Process for preparing an ambient temperature molten salt using t

Details Process for preparing an ambient temperature molten salt using t Process for preparing an ambient temperature molten salt using t

1994-08-25

1996-08-06

Higel, Floyd D.

Organic compounds -- part of the class 532-570 series

Organic compounds

Heterocyclic carbon compounds containing a hetero ring...

546 9, 546341, 5462727, 548101, 5483371, 556170, 564291, 564296, 568 9, 205291, 205292, 205296, 205297, 205298, 106 122, 106 125, 423635, C07F 506, C07D21318, C07D23390, B65D 8518, C25D 2118

Patent

active

055435220

ABSTRACT:
There are disclosed a process for preparing an ambient temperature molten salt, which comprises treating an ambient temperature molten salt consisting essentially of 20 to 50 mole % of an aluminum halide and 80 to 50 mole % of an onium halide, containing oxygen-containing impurities originating from water with thionyl chloride and
a process for preparing an ambient temperature molten salt for effecting aluminum electroplating, which comprises treating mixed ambient temperature molten salts consisting essentially of 30 to 50 mole % of an aluminum halide and 70 to 50 mole % of an onium halide, containing oxygen-containing impurities originating from water with thionyl chloride, and then adding aluminum halide to the molten salt to prepare an ambient temperature molten salt composition consisting essentially of 50 to 80 mole % of an aluminum halide and 50 to 20 mole % of an onium halide.

REFERENCES:
patent: 5135825 (1992-08-01), Mori et al.

Affiliated with

Also associated with

Rating

Process for preparing an ambient temperature molten salt using t does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for preparing an ambient temperature molten salt using t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for preparing an ambient temperature molten salt using t will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2192005