Process for adhesively attaching a semiconductor device to an el

Details Process for adhesively attaching a semiconductor device to an el Process for adhesively attaching a semiconductor device to an el

1994-08-16

1996-08-06

Fourson, George

Fishing, trapping, and vermin destroying

257688, 257689, 257694, H01L 2158, H01L 2152

Patent

active

055433634

ABSTRACT:
In a semiconductor device, a semiconductor element is stored in a casing while being held by external electrodes through first and second electrodes. The outer peripheral edge of the first electrode plate is projected outwardly beyond that of the semiconductor element and a ring-shaped groove is provided in the first surface of the first electrode plate along the outer peripheral edge of the semiconductor element such that a line, which is projected along the outer peripheral edge of the semiconductor element on the first surface of the first electrode plate, is located on the ring-shaped groove portion. The adhesive holding member is applied in the groove and the outer peripheral portion of the semiconductor element. Thus, the semiconductor element is fixed to the first electrode plate and is protected by the adhesive holding member which covers its end portion.

REFERENCES:
patent: 4388635 (1983-06-01), Watanabe et al.
patent: 4775916 (1988-10-01), Kouzuchi et al.
patent: 4926240 (1990-05-01), Regione
patent: 5005069 (1991-04-01), Wasmer et al.

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