Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating
Patent
1984-03-19
1986-03-11
Demers, Arthur P.
Chemistry: electrical and wave energy
Processes and products
Vacuum arc discharge coating
118 501, 118715, 118620, 118718, 118719, 118720, 118728, 156345, 156643, 156646, 204192R, 204298, C23C 1500
Patent
active
045754080
DESCRIPTION:
BRIEF SUMMARY
In the Dutch Patent Applications No's 8 103 979 and 8 200 753 of the applicant a transport system for substrates is disclosed, whereby these substrates are fed through a centrally positioned passage of a cabin and in that passage aside the substrate at least locally flowing gaseous medium establishes a floating transport of these substrates with at least almost no mechanical contact thereof with cabin components.
The apparatus according to the invention shows some improvements for the transport system towards and from particular modules, in which complicated processings under high vacuum take place and is mainly characterized by including means to at least locally establish an independent transport of the substrates by means of flowing gaseous medium, moving along these substrates.
A following positive characteristic is that the gaseous medium, fed towards such substrates, is splitted up in a main flow in direction of substrate movement towards a discharge and a secondary flow, moving in opposite direction towards another discharge and with a lower speed. Consequently, the resulting thrust of these flows on the substrate is in the direction of substrate movement.
Furthermore, the difference in speed of the flows is obtained by, as seen in direction of movement of the substrates, different widths of the transporter system segments with the smallest width in the direction of substrate movement.
The substrate might be a tape, which during the processing is indepently fed through the apparatus. Therefor, the text of this application is also applicable to such tapes.
The substrates have tolerances in thickness, flatness, roughness and bow. Consequently, with a constant width of the passage, both gap widths in between the substrates and the passage-wall sections of the transporter segments vary, resulting in a variable flowing speed of the gaseous medium, a variable thrust of the gaseous medium on the substrates and consequently a variable speed of the substrates.
The apparatus is now characterized, in that in the direction of substrate movement in between the transporter segment packages free areas are located for the positioning of sensors for regulation of the gaseous medium pressure in the passage depending upon on the quality of these substrates and the type of processing.
In the apparatus modules micro-wave oven drying, metallization, plasma etching, plasma stripping, plasma developing, ion implantation, oxidation, doping and other complicated processing may take place located chambers in between transporters and often together with a high vacuum. Therein the substrates are transported by a transport system, which is part of such modules.
A very positive characteristic is, that in direction of substrate movement the length of such processing chambers in between successive transporter segment packages is smaller than the length of the substrates, that the portion of the passage, located behind such chamber, provides a sufficient guidance for the substrates to correctly enter the passage in front of that chamber.
In particular "high current" ion implantation and micro-wave oven drying require a relatively long lasting processing.
An additional characteristic is, that in the direction of substrate movement a number of successive chambers with the same type of processing are used, with in between transporter segment packages and such packages are provided with a central passage for such substrates.
Due to the extremely low weight of the substrates per square inch, the pressure in the passages between successive module chambers can be very low and locally even near the high vacuum, which is used for such type of processing. Furthermore, in such a passage the same gaseous medium can be used as is required for the processing. Also, the processing module or cabin can be used as a common, wide discharge channel.
Furthermore, until now with high vacuum modules the supply and discharge of substrates accomplished by means of mechanical transport systems or cassettes of substrates are brought into these processing modu
REFERENCES:
patent: 3731823 (1973-05-01), Goth
patent: 3904506 (1975-09-01), Carmichael et al.
patent: 4081201 (1978-03-01), Hassan et al.
patent: 4109157 (1978-08-01), Tanaka
patent: 4226526 (1980-10-01), Spence-Gate
patent: 4278366 (1981-07-01), Loveless et al.
patent: 4299518 (1981-11-01), Whelan
patent: 4331526 (1982-05-01), Kuehnle
Musits et al. IBM Tech. Disc. Bull. 17(10) 1975 p. 2904.
Forslund IBM Tech. Disc. Bull. 13 (1970) pp. 39-40.
Demers Arthur P.
Olsen Warren E.
Semmes David H.
LandOfFree
Method for floating transport of substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for floating transport of substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for floating transport of substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2190914