Process for preparing an assembly of an article and a soluble po

Details Process for preparing an assembly of an article and a soluble po Process for preparing an assembly of an article and a soluble po

1991-07-26

1993-09-28

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427163, 4273855, 4273881, B05D 100, B05D 506, B05D 512

Patent

active

052485196

ABSTRACT:
An assembly of an article and a polyimide is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A soluble polyimide resin solution having a low coefficient of thermal expansion (CTE) was prepared by dissolving the polyimide in solvent and adding a metal ion-containing additive to the solution. Examples of this additive are: Ho(OOCCH.sub.3).sub.3, Er(NPPA).sub.3, TmCl.sub.3, and Er(C.sub.5 H.sub.7 O.sub.2).sub.3. The soluble polyimide resin is combined with the article to form the assembly.

REFERENCES:
patent: 4558117 (1985-12-01), Nakano et al.
patent: 4574056 (1986-03-01), Kimura
patent: 4996293 (1991-02-01), Tsuyoshi
patent: 5037862 (1991-08-01), Nishizawa et al.
patent: 5041513 (1991-08-01), Okinoshima et al.

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