Radiation imagery chemistry: process – composition – or product th – Electric or magnetic imagery – e.g. – xerography,... – Radiation-sensitive composition or product
Patent
1982-12-17
1984-11-20
Kittle, John E.
Radiation imagery chemistry: process, composition, or product th
Electric or magnetic imagery, e.g., xerography,...
Radiation-sensitive composition or product
430 84, 430 95, G03G 5082
Patent
active
044839111
ABSTRACT:
A photoconductive member comprises a support and an amorphous layer comprising a first layer region and a second layer region, the first layer region having photoconductivity comprising an amorphous material which comprises silicon atoms as a matrix and at least one member selected from hydrogen atoms and halogen atoms as a constituent, the first layer region having a layer region (I) containing an impurity controlling the electroconductivity type at the support side, and the second layer region comprising an amorphous material comprising at least both silicon and carbon as constituents.
REFERENCES:
patent: 3210184 (1965-10-01), Uhlig
patent: 4217374 (1980-08-01), Ovshinsky et al.
patent: 4226898 (1980-10-01), Ovshinsky et al.
patent: 4251289 (1981-02-01), Moustakas et al.
patent: 4253882 (1981-03-01), Dalal
patent: 4265991 (1981-05-01), Hirai et al.
patent: 4289822 (1981-09-01), Shimada et al.
patent: 4361638 (1982-11-01), Higashi et al.
patent: 4378417 (1983-03-01), Maruyama et al.
patent: 4394425 (1983-07-01), Shimizu et al.
Kanbe Junichiro
Ogawa Kyosuke
Osato Yoichi
Saitoh Keishi
Shirai Shigeru
Canon Kabushiki Kaisha
Goodrow John L.
Kittle John E.
LandOfFree
Photoconductive member with amorphous silicon-carbon surface lay does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photoconductive member with amorphous silicon-carbon surface lay, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoconductive member with amorphous silicon-carbon surface lay will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2189501