Method for manufacturing a cubically integrated circuit arrangem

Details Method for manufacturing a cubically integrated circuit arrangem Method for manufacturing a cubically integrated circuit arrangem

1995-01-23

1996-06-25

Fourson, George

Fishing, trapping, and vermin destroying

437203, 437208, 437225, 437915, 437974, 205656, 205665, H01L 21288, H01L 2160

Patent

active

055299504

ABSTRACT:
A method used in manufacturing a cubically integrated circuit arrangement. A silicon wafer, wherein through pores are produced by electrochemical etching are insulated from the silicon wafer, and are provided with conductive fills, is secured as a carrier plate (24) to a substrate (21) that has components and that is integrated in a cubically integrated circuit arrangement. Terminal pads (25) that are electrically connected to conductive fills and that are arranged on the surface of the carrier plate (24) thereby meet contacts (23) to the components that are arranged at the surface of the substrate (21) adjoining the carrier plate (24) and that are firmly connected thereto.

REFERENCES:
patent: 4437109 (1984-03-01), Anthony et al.
patent: 4667220 (1987-05-01), Lee et al.
patent: 4893174 (1990-01-01), Yamada et al.
patent: 4939568 (1990-07-01), Kato et al.
patent: 5153814 (1992-10-01), Wessely
patent: 5244817 (1993-09-01), Hawkins et al.
patent: 5262021 (1993-11-01), Lehmann et al.
patent: 5306647 (1994-04-01), Lehmann et al.
patent: 5360759 (1994-11-01), Stengl et al.
patent: 5401672 (1995-03-01), Kurtz et al.
patent: 5403752 (1995-04-01), Bruchhaus et al.
patent: 5426072 (1995-06-01), Finnila
"Laser dye impregnation of oxidized porous silicon wafers", L. T. Canham, Appl. Phys. Lett. 63 (3), Jul. 19, 1993, pp. 337-339.
"Fabrication of Three-Dimensional IC Using Cumulatively Bonded IC (CUBIC) Technology", Y. Hayashi et al., IEEE Symposium on VLSI Technology, pp. 95-96, 1990 (Best Date Available).

Affiliated with

Also associated with

Rating

Method for manufacturing a cubically integrated circuit arrangem does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a cubically integrated circuit arrangem, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a cubically integrated circuit arrangem will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2188561