System and a method for mounting electronic components

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29743, 29 7, B23P 1900, H05K 330

Patent

active

057617988

ABSTRACT:
A system and a method for mounting electronic components on a printed circuit board are disclosed. The system comprises a component supporting stage, a board bearing stage, mounting heads, vacuum bits, pressure sensors, device for computing thresholds, and device for determining the status of the pick-up operation of the vacuum bits. The method comprises the steps of detecting a first pressure value of a vacuum bit at which the vacuum bit is open and a second pressure value of the vacuum bit at which the vacuum bit is closed, computing a threshold value in response to the detected first and second pressure values, and moving the mounting heads to the board bearing stage in response to a determination that the pressure value of the vacuum bit at which the component is picked up exceeds the threshold values.

REFERENCES:
patent: 4683654 (1987-08-01), Scholten et al.
patent: 5029383 (1991-07-01), Snyder et al.
patent: 5475619 (1995-12-01), Sugano et al.
patent: 5498942 (1996-03-01), Ijuin

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and a method for mounting electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and a method for mounting electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and a method for mounting electronic components will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2188458

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.