Method of manufacturing electronic device having multilayer wiri

Details Method of manufacturing electronic device having multilayer wiri Method of manufacturing electronic device having multilayer wiri

1980-05-12

1982-08-31

Brammer, Jack P.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29577R, 1566591, 430314, 430317, 430318, 430319, 430272, 430281, 430283, 430312, 427264, 427265, G03C 500

Patent

active

043473067

ABSTRACT:
Electronic devices having a multilayer wiring structure, such as a semiconductor device, a bubble memory device and a thin film magnetic head, are manufactured by using, as an insulation layer-forming material, a thermosetting addition polymerization type polyimide, i.e., a polyimide possessing imide rings in the recurring unit thereof and the degree of polymerization of which increases, when cured, due to the radical reaction of the end group or groups. The polyimide insulation layer exhibits better levelling property than that of a conventional condensational type polyimide.

REFERENCES:
patent: 4023999 (1977-05-01), Lindberg et al.
patent: 4092442 (1978-05-01), Agnihotri et al.
patent: 4218283 (1980-08-01), Saiki et al.

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