Electrodeposition of copper, acidic copper electroplating baths

Details Electrodeposition of copper, acidic copper electroplating baths Electrodeposition of copper, acidic copper electroplating baths

1981-05-29

1982-08-31

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204DIG2, 2521821, C25D 338

Patent

active

043471080

ABSTRACT:
Aqueous acidic copper plating baths and processes for electrodepositing bright and level copper coatings are described. In addition to containing one or more bath-soluble copper salts, free acid and chloride ions, the copper plating baths of the invention contain a brightening compound and a heterocyclic nitrogen or sulfur-nitrogen compound. The brightener compounds are prepared by reacting a mixture of

REFERENCES:
patent: 3798138 (1974-03-01), Ostrow et al.
patent: 4134803 (1979-01-01), Eckles et al.

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