Fishing – trapping – and vermin destroying
Patent
1994-04-28
1995-08-15
Quach, T. N.
Fishing, trapping, and vermin destroying
437 52, 437187, 437229, H01L 21283, H01L 21312
Patent
active
054419166
ABSTRACT:
In a semiconductor device, a first conductive interconnection layer and a second conductive interconnection layer are formed respectively on a lower surface and a higher surface of an interlayer insulation film interposing a step-like portion therebetween by employing different photolithography and etching. A dummy interconnection is provided directly beneath the second conductive interconnection layer in the vicinity of the step-like portion. The first and second conductive interconnection layers and are electrically connected to each other by a conductive layer formed directly on the dummy interconnection in a region including the step-like portion to extend over the surface of a silicon substrate. Consequently, even if the step-like portion is larger than depth of focus, the first and second conductive interconnection layers are precisely patterned within depth of focus.
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Mitsubishi Denki & Kabushiki Kaisha
Quach T. N.
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