Chemistry: electrical and wave energy – Processes and products
Patent
1978-06-07
1980-08-12
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
427 98, 427306, C25D 502, C25D 556, B05D 512, B05D 300
Patent
active
042171822
ABSTRACT:
A method of making a printed circuit board from a laminate structure comprising an insulative laminate base, a layer of semi-cured adhesive material, a layer of electroless copper and an electroplating resist covering the surfaces in the negative of the image of the desired conductor configuration which comprises immersing said resist covered structure in an acid cleaning solution for cleaning said structure; immersing said laminate structure in an acidic copper electroplating solution and coupling an electrical source to said structure for electroplating acid copper onto the exposed portions of said electroless copper and retaining said structure in said solution for an interval sufficient to produce a plating of electroplated copper of a thickness in the range of 0.0005 to 0.005 inches; immersing said structure containing said electroplated copper in a stripping solution for an interval of time to remove said resist material and expose an embossed surface of metal in which the electroplated copper forms a raised portion of the embossment and is in the positive image of said desired conductor configuration and in which the electroless copper forms the recessed portion of said embossment; immersing said structure containing said embossed surface of copper material in a copper etchant solution for differentially etching said electroless copper and said electroplated copper for an interval sufficient to remove the electroless copper in the recesses of said embossment without significant removal of said electroplated copper and for removing traces of catalyst. And a circuit board produced according to the above-recited process.
REFERENCES:
patent: 3615736 (1971-10-01), Stone
patent: 3625758 (1971-12-01), Stahl
patent: 3628999 (1971-12-01), Schneble, Jr.
patent: 3635758 (1972-01-01), Schneble, Jr.
patent: 3694250 (1972-09-01), Grunwald
patent: 3854973 (1974-12-01), Mersereau
patent: 3865623 (1975-02-01), Allen, Jr.
patent: 3874897 (1975-04-01), Fadgen
patent: 3930963 (1976-01-01), Polichette
patent: 3956041 (1976-05-01), Polichette
patent: 3960573 (1976-06-01), Zeblisky
Litton Systems Inc.
Seldon Robert A.
Tufariello T. M.
LandOfFree
Semi-additive process of manufacturing a printed circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semi-additive process of manufacturing a printed circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semi-additive process of manufacturing a printed circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2181389