Thermoset imidazole cured epoxy-polysulfide rubber automotive bo

Details Thermoset imidazole cured epoxy-polysulfide rubber automotive bo Thermoset imidazole cured epoxy-polysulfide rubber automotive bo

1978-06-21

1980-02-05

Jacobs, Lewis T.

Stock material or miscellaneous articles

Composite

Of epoxy ether

260 37EP, 260 37M, C08L 6302

Patent

active

041873483

ABSTRACT:
In a preferred embodiment, a spreadable, thermosetting automotive body solder is comprised of 100 parts of an epoxy resin adduct of epichlorohydrin and bisphenol A, 25 to 40 parts liquid polysulfide rubber, 0.02 to 0.06 moles of an imidazole curing agent substituted in the 2-position with a hydrocarbon group, and a filler system consisting of 5 to 20 parts aluminum powder, 10 to 20 parts ion-exchanged clay, 3 to 6 parts wetting agent for the clay, and 70 to 130 parts fibrous or plate talc average particle size 3 microns or less. The composition is workable for several hours at room temperatures but cures in a few minutes at temperatures over 100.degree. C. The filler system provides the body solder with thixotropic properties at room temperatures, and sag resistance in both the cured and uncured states at temperatures up to 200.degree. C. The solder is corrosion resistant without other additives.

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patent: 3356645 (1967-12-01), Warren
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patent: 3579473 (1971-05-01), Salensky
patent: 3849366 (1974-11-01), Patrick
patent: 3894977 (1975-07-01), Brown et al.
patent: 3923571 (1975-12-01), Aoki et al.

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