High-frequency circuit arrangement and semiconductor device for

Details High-frequency circuit arrangement and semiconductor device for High-frequency circuit arrangement and semiconductor device for

1986-09-26

1988-04-19

Edlow, Martin H.

357 74, 357 80, 357 41, 357 55, 357 40, H01L 2316

Patent

active

047393890

ABSTRACT:
In a high-frequency circuit arrangement, passive parts of the circuit are realized in a semiconductor body in which active circuit elements of another semiconductor material are located in recesses in the semiconductor body. When the semi-conductor body is at least in part low-ohmic, a reference plane, for example, the ground plane, can extend very close to the elements of the circuit arrangement. Consequently, due to the shorter connections required, parasitic effects are considerably reduced. When only one active element is mounted and only connections for this element are formed on the semiconductor body, a very suitable support for mounting and measurement is obtained.

REFERENCES:
patent: 3022472 (1962-02-01), Tanenbaum et al.
patent: 3138744 (1964-06-01), Kilby
patent: 3786375 (1974-01-01), Sato et al.
patent: 3996603 (1976-12-01), Smith
patent: 4023198 (1977-05-01), Malone et al.
patent: 4092664 (1978-05-01), Daus, Jr.
patent: 4122479 (1978-10-01), Sugawara et al.
patent: 4443808 (1984-04-01), Kihara et al.
patent: 4456488 (1984-06-01), Gahle
patent: 4463322 (1984-07-01), Scott et al.

Affiliated with

Also associated with

Rating

High-frequency circuit arrangement and semiconductor device for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-frequency circuit arrangement and semiconductor device for , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-frequency circuit arrangement and semiconductor device for will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2179805