Polishing machine

Abrading – Machine – Rotary tool

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Details

451288, 451388, B24B 722

Patent

active

054414440

ABSTRACT:
An object of the present invention is to provide a polishing machine having a smaller holding section. In the polishing machine of the present invention, a polishing plate polishes a wafer. A holding section has a concave section. A carrying plate, which is provided in the concave section, holds the wafer. A press mechanism for pressing the carrying plate toward the polishing plate comprises an elastic plate dividing an inner space of the concave section into an upper space, which is formed as an air tight chamber, and a lower space, and allowing the carrying plate to move in the vertical and the horizontal directions by elastic transformation, and a fluid supplying unit for supplying fluid into the upper space for pressurizing. In the polishing machine, the elastic plate is formed into a plate, so that its size in the vertical direction can be small, and the vertical size of the polishing machine also can be smaller.

REFERENCES:
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5205082 (1993-04-01), Shendon

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