Assembly substrate and method of making

Details Assembly substrate and method of making Assembly substrate and method of making

1996-02-01

1998-07-28

Krynski, William

Stock material or miscellaneous articles

Composite

Of metal

428209, 428216, 428336, 428472, 428610, 428632, 428633, 428660, 428635, 428698, 428701, 428702, 427249, 427255, 4272553, 20419215, 20419216, 20419223, B32B 900

Patent

active

057860971

ABSTRACT:
An assembly substrate includes a substrate (11, 31, 41), a composite layer (12, 32, 42) overlying the substrate (11, 31, 41), and an electrically conductive layer (13, 33, 43) overlying the composite layer (12, 32, 42). The composite layer (12, 32, 42) includes a first material having an as-deposited tetragonal crystal structure and a second material. The second material in the composite layer (12, 32, 42) reduces the susceptibility of the composite layer (12, 32, 42) to fracture under stress.

REFERENCES:
patent: 4532190 (1985-07-01), Kanbe et al.
patent: 4904542 (1990-02-01), Mroczkowski
patent: 5192410 (1993-03-01), Ito et al.
patent: 5472795 (1995-12-01), Atita
Scanlan et al., Applied Physics Letter, "Tetragonal zirconia growth by nanolaminate formation", Jun. 27, 1994, vol. 64, No. 26, pp. 3548-3550.

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