Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1995-06-01
1996-02-06
Thomas, Laura
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174260, 174266, 361767, 361768, 361760, 29832, 29833, 29840, H05K 114
Patent
active
054897505
ABSTRACT:
A method of mounting an electronic part with bumps on a circuit board is disclosed which enables bumps to be bonded to electrodes of the circuit board with certainty and which enables the judgement of the quality of bonding with precision. By making an area of the electrodes of the circuit board larger than those of the electrodes of the electronic part, the bumps heated and molten in the reflow soldering are spread over the electrodes of the circuit board to make its vertical cross-sectional configuration in a trapezoidal form. Therefore, the height dispersion of the bumps and the curvature of the circuit board are effectively absorbed whereby all the bumps can be bonded to the electrodes of the circuit board. Further, by measuring the planar area of the bumps, the judgement of the quality of bonding can be made with precision.
REFERENCES:
patent: 5011066 (1991-04-01), Thompson
patent: 5192835 (1993-03-01), Bull et al.
patent: 5233504 (1993-08-01), Mellon et al.
patent: 5266749 (1993-11-01), Kawakami et al.
patent: 5329423 (1994-07-01), Scholz
Sakemi Shoji
Wada Yoshiyuki
Matsushita Electric - Industrial Co., Ltd.
Thomas Laura
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