Headphone construction

Patent

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Details

179182R, H04M 105, H04R 110

Patent

active

043026354

ABSTRACT:
A headphone includes a pair of ear cup assemblies attached to a headband. Each ear cup assembly includes a cushion, an earplate, a back plate and an acoustic transducer. These elements snap together and are held together by integral fasteners. Each ear cup assembly is attached to the headband by a ring-shaped yoke which is entrapped between the assembled back plate and ear plate. The result is a durable, lightweight structure which is easy to assemble on a mass production basis.

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patent: 3447160 (1969-06-01), Teder
patent: 3579640 (1971-05-01), Beguin et al.
patent: 3787899 (1974-01-01), Krawagna
patent: 3875592 (1975-04-01), Aileo
patent: 4027113 (1977-05-01), Matsumoto et al.
patent: 4041256 (1977-08-01), Ohta et al.
patent: 4058688 (1977-11-01), Nishimura et al.
patent: 4156118 (1979-05-01), Hargrave

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