Porous, heat resistant insulating substrates for use in printed

Details Porous, heat resistant insulating substrates for use in printed Porous, heat resistant insulating substrates for use in printed

1978-06-08

1981-11-24

Cannon, James C.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

156634, 174 685, 428316, 428317, 428318, 428337, 428339, 428901, 156305, 1563071, 1563077, B32B 526, B32B 528, B32B 532, H05K 100

Patent

active

043025013

ABSTRACT:
The insulating substrate comprises an insulating sheet made of cellulose material and a prepreg impregnated with a thermosetting resin and bonded to at least one surface of the insulating substrate. A printed circuit board is prepared by forming electric conductors arranged in a predetermined circuit pattern on the surface of the prepreg.

REFERENCES:
patent: 2547022 (1951-04-01), Leno

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