Stock material or miscellaneous articles – Composite – Of polyimide
Patent
1986-04-23
1988-04-19
Swisher, Nancy A. B.
Stock material or miscellaneous articles
Composite
Of polyimide
428131, 428209, 428901, 525518, 528322, B32R 2700, C08F28300, C08G 7310
Patent
active
047389001
ABSTRACT:
Cured resin obtained by polymerization by heating of a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic polymerization temperature ranges at polymerization by heating substantially coincide with each other, for example, an aromatic maleimide compound and an aromatic cyanamide compound, the composition showing a substantially one exothermic polymerization peak at the polymerization by heating, has a good heat resistance, and a laminated, high density wiring board with a good heat resistance, capable of being directly loaded with LSI chips and chip carriers can be obtained, using the composition.
REFERENCES:
patent: 4254012 (1981-03-01), Green
patent: 4482703 (1984-11-01), Takahashi et al.
patent: 4546168 (1985-10-01), Takahashi et al.
Chemical Abstracts, vol. 102, 1985, p. 37, Abstract No. 186027s, Columbus, Ohio, U.S.; & JP-A-59 196 363, (Hitachi, Ltd.), 07-11-1984.
Chemical Abstracts, vol. 103, 1985, p. 39, Abstract No. 179165c, Columbus, Ohio, U.S.; & JP-A-60 94 422, (Hitachi, Ltd.), 27-05-1985.
Chemical Abstracts, vol. 100, 1984, p. 92, Abstract No. 122903a, Columbus, Ohio, U.S.; & JP-A-58 179 229, (Hitachi, Ltd.), 20-10-1983.
Nagai Akira
Narahara Toshikazu
Ono Masahiro
Sugawara Katuo
Tada Ritsuro
Hitachi , Ltd.
Ryan Patrick J.
Swisher Nancy A. B.
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