Process for preparing flexible printed-circuit board

Details Process for preparing flexible printed-circuit board Process for preparing flexible printed-circuit board

1980-05-21

1981-11-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156249, 156634, 156660, 156902, 430319, 430328, B32B 3100, B44C 122, C23F 102

Patent

active

043022685

ABSTRACT:
A flexible printed-circuit board is covered imagewise with a polymer film as a cover layer to improve the flexibility of the board. The cover layer is formed by laminating a photoprintable, photosensitive layer supported on a flexible support to the surface of a flexible printed-circuit board, exposing the photosensitive layer imagewise to light to form a polymer image in the layer and removing the unexposed areas of the layer to leave an imaged polymer film on the surface of the board. The formation of the cover layer can be easily conducted by a continuous operation.

REFERENCES:
patent: 4127436 (1978-11-01), Friel

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