Printed wiring board construction

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

361401, 361403, 361408, 357 80, H05K 114

Patent

active

044133081

ABSTRACT:
A mounting arrangement for an integrated circuit leadless chip carrier (13) for providing compliance to prevent solder joint failures due to stress and differential thermal expansion. A supporting substrate board (10, 20, 30) has bonded to one surface a flexible sheet (11) carrying printed wiring (12) to which the carrier (13) is electrically connected by means of solder pedestals (19). At each of the latter connections the board (10, 20, 30) presents recesses (15, 22, 31a, 33a) over which the sheet (11) is freely suspended to provide free sheet portions (18) which absorb the stress and differential expansion to protect the solder connections.

REFERENCES:
patent: 3344900 (1967-10-01), Drop
patent: 3390308 (1968-06-01), Marley
patent: 3487541 (1970-01-01), Boswell
patent: 3708851 (1973-01-01), Vladik
patent: 3792383 (1974-02-01), Knappenberger
patent: 3864728 (1975-02-01), Peltz et al.
patent: 3875478 (1975-04-01), Capstick
patent: 3908075 (1975-09-01), Jackson et al.
patent: 3930115 (1975-12-01), Uden et al.
patent: 4007479 (1977-02-01), Kowalski
patent: 4042861 (1977-08-01), Yasuda et al.
patent: 4084315 (1978-04-01), Michaels

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