IC Package with heat sink and minimal cross-sectional area

Details IC Package with heat sink and minimal cross-sectional area IC Package with heat sink and minimal cross-sectional area

1979-08-13

1981-07-14

James, Andrew J.

357 70, 357 72, 357 80, H01L 2302, H01L 2348, H01L 2944

Patent

active

042789915

ABSTRACT:
Disclosed is an IC package for connecting one set of nodes on an IC chip to another corresponding set of nodes on a circuit board. Each interconnection is made with a single C-shaped lead which is bonded at one end to a node on the chip. These leads extend outward from the periphery of the chip's surface, then perpendicular to and away from the chip's surface, and then inwards towards each other. A heat sink attaches to the back of the chip. The chip, an adjacent portion of the heat sink, and the outward extending portion of the leads are then encapsulated with a solid mass to hold them rigidly in place.

REFERENCES:
patent: 3735214 (1973-05-01), Renskers
patent: 3781976 (1974-01-01), Tomiwa
patent: 3836825 (1974-09-01), Hall et al.
patent: 3922712 (1975-11-01), Stryker
IBM Technical Disclosure Bulletin, vol. 16, No. 4, Sep. 1973, by Deboskey p. 1153.
IBM Technical Disclosure Bulletin vol. 16, No. 9, Feb. 1974, by Nufer p. 2893.
Western Electric Technical Digest No. 46, Apr. 1977; Circuit Package p. 3.

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