Method and apparatus for monolayering of wafers

Details Method and apparatus for monolayering of wafers Method and apparatus for monolayering of wafers

1985-03-20

1989-01-03

Yost, Frank T.

Cutting

Processes

With subsequent handling

83 26, 83 27, 83 99, 83155, 83165, 83403, 834043, B26D 718, B26D 732

Patent

active

047948337

ABSTRACT:
A method and apparatus for monolayering sliced wafer-like articles such as fruit or vegetable slices to enhance further product processing. The apparatus includes a slice catcher in cooperative relationship with a centrifugal slicer such that discharged product slices impinge onto the slice catcher inner surface and are captured by a flow of liquid passing over the slice catcher inner surface. The slices are controllably separated, conveyed and deposited in monolayered fashion on a conveyor for subsequent processing.

REFERENCES:
patent: 2148922 (1939-02-01), Bachofner
patent: 3139129 (1964-06-01), Urschel et al.
patent: 3239278 (1966-03-01), Mueller et al.
patent: 3944062 (1976-03-01), Keller
patent: 4251555 (1981-02-01), Kroenig

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