Structure for connecting leadless chip carrier

Details Structure for connecting leadless chip carrier Structure for connecting leadless chip carrier

1985-09-04

1987-09-08

James, Andrew J.

357 74, 357 75, 357 80, H01L 2310, H01L 2302, H01L 2332

Patent

active

046927905

ABSTRACT:
A structure for accurately connecting a connection pattern on a leadless chip carrier (LCC) to a connection pattern on a receiving surface by means of a connector, i.e., without resorting to solder. The structure includes a generally frame- or box-shaped support cover in which the LCC is received. The support cover is provided with resilient portions at at least two sides of the inner contour thereof in order to resiliently hold the LCC therebetween. A frame surrounds the support cover to retain the same. The support cover in which the LCC is fit is coupled in the frame and retained therein by a pressure which is exerted by a cover.

REFERENCES:
patent: 4008487 (1977-02-01), Vogt
patent: 4069497 (1978-01-01), Heidlitz
patent: 4563725 (1986-01-01), Kirby
patent: 4605986 (1986-08-01), Bentz et al.

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