Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1985-03-06
1987-12-08
Czaja, Donald E.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156246, 156344, 264213, 26427213, 26427215, 26427217, 264278, 264316, B29C 3918, B29C 3358
Patent
active
047116889
ABSTRACT:
In the present publication a method is described for encapsulating of components (3), in particular of semiconductor components, mounted on a carrier tape (6) by means of a polymer in order to prevent access of moisture into the component (3). According to the invention a polymer film (24, 25) is pressed onto the support area (2) of each component (3) from both sides of the carrier tape (6), and the carrier tape (6) treated in this way is subjected to warm-air blasting (14). Thereupon, an encapsulating tape (9) that has been moistened with polymer (13) and subjected to a warm-air treatment (15) is connected to one side of the carrier tape (6), and the combination tape (6, 9) in this way obtained is heated in a pre-heating oven (16). Hereupon, encapsulating polymer (26) is spread by means of a dispensing and spreading device (17, 18), onto the face of the component (3) and then onto its ILB area (19), and the combination tape (6, 9) in this way treated is heated in an oven zone (20) in order to harden the polymer. Finally, the encapsulating tape (9) is detached from the carrier tape (6) now containing the encapsulated components (3).
REFERENCES:
patent: 2969300 (1961-01-01), Franz
patent: 3754070 (1970-08-01), Dunn et al.
patent: 4069931 (1978-01-01), Saylors
patent: 4079509 (1978-03-01), Jackson et al.
patent: 4238528 (1980-12-01), Angelo et al.
patent: 4374080 (1983-02-01), Schroeder
Czaja Donald E.
Davis J.
Oy Lohja AB
LandOfFree
Method for encapsulating semiconductor components mounted on a c does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for encapsulating semiconductor components mounted on a c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for encapsulating semiconductor components mounted on a c will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-21610