Method of and apparatus for electrodepositing a metal on a subst

Details Method of and apparatus for electrodepositing a metal on a subst Method of and apparatus for electrodepositing a metal on a subst

1982-08-05

1984-02-07

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 26, 204225, C25D 504, C25D 704, C25D 1700

Patent

active

044301677

ABSTRACT:
A method of and apparatus for electrodepositing a metal upon a substrate having one or more recesses of substantial depth to form the metal deposit throughout the surfaces and in the recesses as well. An electrode assembly comprises an elongate anode and a tubular insulator traversed by the elongate anode so that the insulator partially covers the lateral surface of the electrode which is movable in its longitudinal direction. The electrode assembly is positioned to dispose a forward end portion thereof in the recess and to position the tubular insulator on the elongate anode so as to allow only a forward end face portion of the anode to be substantially exposed and the face portion to be juxtaposed with a floor portion of the substrate in the recess. An electrodepositing solution is supplied into the recess and an electric current is passed between the anode and the substrate to permit the metal from the solution to be selectively electrodeposited on the floor portion. Subsequently, the tubular insulator is gradually withdrawn while permitting the elongate anode to remain stationary to progressively increase the lateral area of the elongate anode exposed from the insulator, thereby progressively displacing the region of electrodeposition on the wall surface in the recess.

REFERENCES:
patent: 1809826 (1931-06-01), Bohlman
patent: 4269672 (1981-05-01), Inoue
patent: 4364802 (1982-12-01), Inoue

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