Cooling structure for integrated circuit element modules, electr

Details Cooling structure for integrated circuit element modules, electr Cooling structure for integrated circuit element modules, electr

1995-05-01

1997-06-17

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257721, 361697, H01L 2334

Patent

active

056400462

ABSTRACT:
In a cooling structure for cooling circuit element modules that are mounted on a circuit board and has heat sinks, there are provided a main duct to which the circuit element modules are connected, and a coolant supplying device which is connected to the main duct and supplies a coolant to the main duct.

REFERENCES:
patent: 4296455 (1981-10-01), Leaycraft et al.
patent: 4851965 (1989-07-01), Gabuzda et al.

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