Removable adhesives for attachment of semiconductor dies

Details Removable adhesives for attachment of semiconductor dies Removable adhesives for attachment of semiconductor dies

1992-11-13

1994-08-09

Thomas, Tom

Fishing, trapping, and vermin destroying

437 8, 437207, 437217, 437220, H01L 2160

Patent

active

053366492

ABSTRACT:
In order to provide pretested bare semiconductor integrated circuit die, a temporary mechanical connection is effected by the use of a soluble material. A semipermanent electrical connection is effected, in which the parameters of the connection are controlled, so that the die remains functional subsequent to burnin and test. Subsequent to testing and burnin, the die are removed from the package body. The technique is useful in providing known good die.

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