Capacitive chip carrier and multilayer ceramic capacitors

Details Capacitive chip carrier and multilayer ceramic capacitors Capacitive chip carrier and multilayer ceramic capacitors

1980-08-11

1982-09-14

Kucia, Richard R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 361328, 361329, 361411, H05K 116

Patent

active

043498620

ABSTRACT:
A chip carrier system for supporting electronic semiconductor chips is provided with a matched coefficient of thermal expansion as well as a high value of capacitance. The carrier provides both mechanical and electrical connections to the chip. A small sized interposer for a silicon chip possesses high capacitance. An array of dot capacitors is formed between laminated layers of ceramic material. In some cases, conductive surfaces are provided on the upper and lower surfaces of a thin film of ceramic material in which dielectric bodies are interspersed in an array of openings therein. The resultant ceramic dielectric combination has a coefficient of thermal expansion which matches the coefficient of thermal expansion of the silicon chip and the substrate thereby relieving stress upon the solder ball joints between the interposer and both the chip and the substrate. This minimizes the mechanical stress upon the solder ball joints during thermal cycling of the structure. Alternatively, an array of multilayer ceramic capacitors has an array of dielectric bodies located within holes in ceramic layers between capacitor plates, or entire arrays of capacitors are formed in the space between ceramic sheets.

REFERENCES:
patent: 3273033 (1966-09-01), Rossmeisl
patent: 4109377 (1978-08-01), Blazick
patent: 4202007 (1980-05-01), Dougherty
patent: 4210950 (1980-07-01), Fraser
patent: 4237522 (1980-12-01), Thompson
patent: 4247881 (1981-01-01), Coleman
patent: 4249196 (1981-02-01), Durney
patent: 4274124 (1981-06-01), Feinberg
Lussow, R. O., Internal Capacitors and Resistors for Multilayer Ceramic Modules, IBM Tech. Dis. Bull., V. 20 #9, 2/78, pp. 3436, 3437.

Affiliated with

Also associated with

Rating

Capacitive chip carrier and multilayer ceramic capacitors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Capacitive chip carrier and multilayer ceramic capacitors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Capacitive chip carrier and multilayer ceramic capacitors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2157629