Method for encapsulating electrical components

Details Method for encapsulating electrical components Method for encapsulating electrical components

1975-08-13

1977-09-06

Lowe, James B.

Metal working

Method of mechanical manufacture

Electrical device making

29 2542, 249 94, 264102, 264157, 264272, 264297, B29C 604, B29C 1710, H01G 102, H01G 1153

Patent

active

040458679

ABSTRACT:
In a method for encapsulating electrical components, especially capacitors, plastic moulds joined to a common trough-shaped pouring ingate are used. A liquid, hardenable plastics filling compound is poured into the moulds in excess under vacuum, and the plastics compound is brought to cure. After curing, the pouring ingate together with the surplus filling compound is cut off from the encapsulated components. The mould remains as a cover around the component.

REFERENCES:
patent: 2758183 (1956-08-01), Canegallo
patent: 2856639 (1958-10-01), Forrest et al.
patent: 2960641 (1960-11-01), Cohen et al.
patent: 3141049 (1964-07-01), Parsons
patent: 3261902 (1966-07-01), Pearce et al.
patent: 3289452 (1966-12-01), Kollner
patent: 3560813 (1971-02-01), Phy
patent: 3731371 (1973-05-01), Piper et al.

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