Wire plating

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating moving substrate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

205152, 205170, 205210, 205222, 204209, C25D 706, C25D 510, C25D 552, C25D 1700

Patent

active

056676611

DESCRIPTION:

BRIEF SUMMARY
This is a national stage application of PCT/GB93/01933 filed Sep. 13, 1993.


FIELD OF INVENTION

This invention concerns apparatus and method by which an elongate substrate can be continuously coated, and the elongate material when so produced. The invention is of particular application to the coating or plating of metal typically in the form of wire or tape to achieve a coated material having a desired overall cross-sectional size and temper.


BACKGROUND TO THE INVENTION

For many applications wire or tape must be plated on its external surface such as for protection or insulation. Where the overall cross-sectional size of the coated or plated material does not have to be held to a high tolerance, known processes may be employed.
Difficulties arise where continuous plating has to achieve a particular overall cross-sectional size for the end product and the invention is of particular importance in such processes.
It is therefore a primary object of the present invention to provide a method and apparatus for plating in a continuous manner a conductive substrate typically in the form of wire or tape and typically of metal so as to enable a final predictable and accurately controlled cross-section size of the plated material to be obtained.
It is a subsidiary object of the invention to provide apparatus and method by which continuously produced plated wire or tape has not only a controlled cross-sectional size but also a controlled surface finish.


SUMMARY OF THE INVENTION

According to one aspect of the present invention a method of continuously coating a conductive substrate so as to achieve a desired overall cross-sectional size of the coated material comprises the steps of: cross-sectional size which is somewhat greater than that desired in the end product; passes through an electro plating bath; and cross-sectional area to the desired size.
Preferably the surface of the substrate material is cleaned prior to the electro plating step using acid or alkaline washes as appropriate.
Preferably the plated material is rinsed and dried after it is passed through the electro plating bath and before it is drawn, so as to remove any plating bath materials from the surface of the plated substrate.
Preferably the first mentioned drawing step is followed by a stress relieving step.
Preferably the plated substrate material is heated and dried after rinsing and prior to passing through the final die.
Where the substrate is a metal typically a metal alloy, the reduction in size effected by the final die is also arranged to introduce the desired temper into the metal substrate as a result of the drawing through the die.
It will be found that in general the drawing of the plated material through the final die will result in a more uniform thickness of plated material over the substrate and an improvement in the surface finish or smoothness of the plated surface. This is particularly so where high current density has to be employed in order to achieve rapid plating as the substrate passes through the electro plating bath.
Where two or more materials are to be plated on the original substrate one above the other, the substrate may be passed through second and subsequent electro plating baths with appropriate rinsing and washing stations between each bath in manner known per se.
Additionally the invention envisages the use of two or more electro plating baths each plating the same material onto material passing therethrough, thereby enabling a greater thickness of the plating material to be applied to the original substrate than would be possible by passing the substrate through a single plating bath. In this arrangement the baths are arranged in series so that the material passes from one to the next in sequence with or without rinsing between baths as appropriate.
The invention also lies in apparatus for performing the aforementioned method comprising at least one die through which elongate substrate material in a continuous length can be drawn to achieve a first overall cross-sectional size, electro plating means throug

REFERENCES:
patent: 2580801 (1952-01-01), Leonard
patent: 3920409 (1975-11-01), Taniguchi
patent: 4952249 (1990-08-01), Dambre

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wire plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire plating will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-215554

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.