Method of making high metal content circuit patterns on plastic

Details Method of making high metal content circuit patterns on plastic Method of making high metal content circuit patterns on plastic

1983-07-25

1988-10-04

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156239, 156246, 264213, 427 96, 427282, B29B 100, B44C 116, B29C 3340, B05D 512

Patent

active

047754397

ABSTRACT:
A low temperature method of forming a circuit pattern on a plastic substrate which comprises applying a slurry of a vaporizable solvent, metal particles and a small quantity of binder in the shape of the circuit pattern desired to a removable layer, vaporizing the solvent, covering the powdered metal and binder with an adhesive to hold the powdered metal and carrier in place on the removable layer, laminating the hydrocarbon containing substrate with pressure and heat to cause compacting of said powder and bonding of said compacted powder to said substrate by adhesive layer, said heat being insufficient to destroy said adhesive, substrate and removable layer, and separation of the removable layer. A circuit pattern held on a removable layer by an adhesive overlying same is also disclosed.

REFERENCES:
patent: 2721152 (1955-10-01), Hopf et al.
patent: 2721153 (1955-10-01), Hopf et al.
patent: 3589962 (1971-06-01), Bonjour
patent: 3703603 (1972-11-01), Levesque et al.
patent: 4049844 (1977-09-01), Bolon et al.
patent: 4322316 (1982-03-01), Provance et al.
patent: 4343833 (1982-08-01), Sawae et al.
patent: 4373019 (1983-02-01), Watanabe et al.

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