Method for forming oxide-capped trench isolation

Fishing – trapping – and vermin destroying

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437 67, 437 69, H01L 21265

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active

048351156

ABSTRACT:
A method of forming trench isolation is disclosed. A trench is etched, either through field oxide or not, into the substrate, using an oxide hard mask. Implant of a channel-stop is then performed through a dummy sidewall oxide, followed by stripping of the dummy oxide and regrowth of the sidewall oxide. A polysilicon layer is deposited into the trench and over the wafer, and is etched to clear from the surface, and overetched so that a recess is formed within the trench. The recess is then filled with a TEOS oxide layer deposited over the wafer surface, and the deposited oxide at the top of the trench is planarized with the surrounding surface.

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Yamada et al., "A Deep-Trenched Capacitor Technology for 4 Mega Bit Dynamic Ram", IEDM (1985), pp. 702-705.

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