Metal treatment – Stock – Aluminum base
Patent
1988-05-06
1989-05-30
Dean, R.
Metal treatment
Stock
Aluminum base
148438, C22C 2100
Patent
active
048348104
ABSTRACT:
High modulus aluminum-base comprise mechanically alloyed aluminum-base compositions contain 10-25% titanium part of which may be replaced by vanadium or zirconium. Within described limits the alloys can contain elements other than oxygen and carbon ordinarily derived from the process control agent used in mechanical alloying.
REFERENCES:
patent: 2966735 (1961-01-01), Towner et al.
patent: 3740210 (1973-06-01), Bomford et al.
patent: 4557893 (1985-12-01), Jatkur et al.
patent: 4600556 (1986-07-01), Donachie et al.
patent: 4624705 (1986-11-01), Jatkur et al.
patent: 4627959 (1986-12-01), Gilman et al.
patent: 4643780 (1987-02-01), Gilman et al.
patent: 4668282 (1987-05-01), Gilman et al.
patent: 4668470 (1987-05-01), Gilman et al.
"Dev. of a Mech. Alloyed Aluminum Alloy for 450.degree.-650.degree. F. Service" Air Force WAL Tech. Report AFML TR79-4210.
"Herstellung and Eigenschafter etc." Aluminum (Duesseldorf) 1975, V51, No. 10, 641-5, Langg et al.
Dispersion Hardening of Aluminum with Al.sub.4 C.sub.3 Jangg et al., Powder Met. Int., Vol. 9, No. 1, 1977,
"New Tech. Developments in the Dispersion Hardening of Al & Cu" Korb et al., Wire, vol. 28, 1979, No. 6, pp. 258-262.
"Coarsening of Rapidly Solidified Al-Ti Alloys" Frazier et al., High Strength Powder Metallurgy Al Alloys II-Oct. 1985.
"Mechanical and Thermal Stability etc.", Frazier et al., Scripta Metallurgica, vol. 21, pp. 129-134, 1987.
Benn Raymond C.
Mattson Walter E.
Mirchandani Prakash K.
Dean R.
INCO Alloys International, Inc.
Kenny Raymond J.
Mulligan, Jr. Francis J.
LandOfFree
High modulus A1 alloys does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High modulus A1 alloys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High modulus A1 alloys will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2149961