Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1980-06-04
1982-09-14
Rutledge, L. Dewayne
Metal working
Method of mechanical manufacture
Assembling or joining
156601, 156626, 250548, 250557, 250568, 2504922, 235469, 235491, 3401463B, 3401463Z, 356402, 427 10, H01L 2166, H01L 2184
Patent
active
043488030
ABSTRACT:
In a process for producing a semiconductor device using an insulating substrate, a so called SOS device, a semiconductor layer is formed on the insulating film and semiconductor elements are formed in the semiconductor layer, material, which develops color with in the insulating substrate, is introduced in the substrate, and a color developed part of the insulating substrate is used as an identification mark of the substrate and the semiconductor elements. Cracking of the substrates due to formation of the identification mark is prevented.
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patent: 3710101 (1973-01-01), O'Keeffe et al.
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patent: 4203799 (1980-05-01), Sugawara et al.
Denning, P. A., "Automatic Alignment . . . Wafer Fabrication" Solid State Technology, May 1976, pp. 43-47.
Fujitsu Limited
Rutledge L. Dewayne
Saba W. G.
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