Two-phase optical inspection method and apparatus for defect det

Image analysis – Applications – Manufacturing or product inspection

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382318, 348126, G06K 900

Patent

active

056994478

ABSTRACT:
A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected by scanning its complete surface at a relatively high speed and with an optical beam of relatively small diameter, particularly a laser beam, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.

REFERENCES:
patent: 4532650 (1985-07-01), Wihl et al.
patent: 4589140 (1986-05-01), Bishop et al.
patent: 4618938 (1986-10-01), Sandland et al.
patent: 4693608 (1987-09-01), Kitagawa et al.
patent: 4764969 (1988-08-01), Ohtombe et al.
patent: 4791586 (1988-12-01), Maeda et al.
patent: 4805123 (1989-02-01), Specht et al.
patent: 4845558 (1989-07-01), Tsai et al.
patent: 4872052 (1989-10-01), Liudzius et al.
patent: 4926489 (1990-05-01), Danielson et al.
patent: 5133601 (1992-07-01), Cohen et al.
patent: 5159646 (1992-10-01), Kumagai
patent: 5204910 (1993-04-01), Lebeau

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