Stock material or miscellaneous articles – Composite – Of metal
Patent
1999-09-02
2000-12-12
Lam, Cathy F.
Stock material or miscellaneous articles
Composite
Of metal
428333, 428338, 428339, 257709, 257724, 257725, B32B 1508
Patent
active
061596094
ABSTRACT:
An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe are disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed for further prevention of adhesive application to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated, as well as leadframes.
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Lam Cathy F.
Micro)n Technology, Inc.
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