Method for transferring heat to or from a semiconductor wafer us

Details Method for transferring heat to or from a semiconductor wafer us Method for transferring heat to or from a semiconductor wafer us

1992-05-13

1995-08-22

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

437228, 437248, 118 501, 118620, 427569, H01L 2100, H01L 2102, G03F 726

Patent

active

054439973

ABSTRACT:
A method for heating or cooling a semiconductor wafer in semiconductor processing apparatus is described which comprises directing into contact with a surface of the wafer at least a portion of one or more components of the process gas to transfer heat between the wafer and a wafer support positioned in the apparatus adjacent to the wafer. Method and apparatus are also described for controlling the total flow of process gas through the apparatus and for monitoring the pressure in said apparatus to maintain the desired pressure therein.

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Hammer, W., "Cooling Ion-Implantation Target," IBM Tech. Discl. Bull., vol. 19, No. 6, Nov. 1976, pp. 2270-2271.
King, M., "Experiments on Gas Cooling of Wafers," Nuclear Instruments and Methods, vol. 189, 1981, pp. 169-173.

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