Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly single metal or alloy substrate of...
Patent
1992-09-21
1994-08-09
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating predominantly single metal or alloy substrate of...
205184, 205215, 205258, 205920, C25D 356, C25D 706
Patent
active
053363914
ABSTRACT:
An improved circuit board material having a support layer, an electrical resistance layer and a conductive layer. The circuit board material has a resistance of at least about 500 ohms/square. The circuit board material is formed by electro-plating the electrical resistance layer on the conductive layer. The conductive layer is desirably activated prior to electro-deposition of the electrical resistance layer thereon. The conductive layer is activated by contacting with an activating agent such as benzotriazole electrolytic chromate and the like. A preferred electro-plating bath for electro-deposition of the electrical resistance layer comprises about 0.5 mole per liters nickel hypophosphite. The disclosed electro-plating bath functions at ambient temperatures and is effectively temperature independent. Circuit boards can be formed from the circuit board material through a process involving only two etching steps.
REFERENCES:
patent: 2644787 (1953-07-01), Bonn
patent: 3500926 (1970-03-01), Richardson
patent: 4101389 (1978-07-01), Uedaira
patent: 4459184 (1984-07-01), Kukanskis
patent: 4770751 (1988-09-01), Kawagishi et al.
patent: 4888574 (1989-12-01), Rice et al.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 389-400.
Leader William T.
Niebling John
Ohmega Electronics, Inc.
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