Producing thick film circuits having terminal elements

Details Producing thick film circuits having terminal elements Producing thick film circuits having terminal elements

1977-02-22

1978-04-18

DiPalma, Victor A.

Metal working

Method of mechanical manufacture

Electrical device making

29625, 174 685, 228180R, 228219, 228238, 427190, 427191, H05K 330, H05K 334

Patent

active

040843149

ABSTRACT:
A process for producing a thick film circuit with terminal elements on an inorganic substrate. A paste of silver powder, copper oxide powder and organic bonding agent is silk screen printed on an inorganic substrate, dried and sintered. Then over preselected locations along individual conductor paths terminal elements are hard soldered. The conductor paths are strongly adhered to the inorganic substrate and the terminal elements are likewise strongly adhered to the individual conductor paths.

REFERENCES:
patent: 3374110 (1968-03-01), Miller
patent: 3714709 (1973-02-01), Liederbach
patent: 3904461 (1975-09-01), Estep et al.

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