Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-01-24
1999-11-02
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257706, 257722, 257783, 257693, H01L 2310, H01L 2334, H01L 2348, H01L 2352
Patent
active
059776293
ABSTRACT:
A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curable resin. An array of heat fins is bonded to the inactive surface of the wafer by a thermally conductive curable resin.
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"Electronic Packaging and Interconnection Handbook" C. Harper.
"Electronic Packaging and Interconnection Handbook", pp. 7.24-7.27,C. Harper.
H. Stopper; "Wafer-Scale Integration"; pp. 354-364.
Fogal Rich
Wood Alan G.
Clark Jhihan B.
Micro)n Technology, Inc.
Saadat Mahshid D.
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