Flux for soldering and solder composition comprising the same an

Details Flux for soldering and solder composition comprising the same an Flux for soldering and solder composition comprising the same an

1994-11-03

1995-08-22

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 24, 148 25, B23K 3534

Patent

active

054436591

ABSTRACT:
Flux for soldering comprising inorganic ion-exchanger and activator containing halogen atom, solder composition the flux and solder particles, soldering method comprising coating the solder composition on a portion for soldering, soldering method comprising coating flux containing activator on a portion for soldering, applying inorganic ion-exchanger to the portion and applying solder to the portion, and soldering method comprising mixing inorganic ion-exchanger with creamy solder to give mixture, coating the mixture on a circuit pattern of a wiring plate and heating the wiring plate. The flux for soldering and the soldering composition are excellent in metal ion-migration resistance, corrosion resistance, soldering property and storage stability, and can be preferably used without cleaning and the soldering methods can be preferably used in practical no-clean soldering methods.

REFERENCES:
patent: 3175933 (1965-03-01), Wasserman
patent: 3840411 (1974-10-01), Rozzi et al.
patent: 4187348 (1980-02-01), Dearlove et al.
patent: 4460414 (1984-07-01), Hwang
M. Kitajima et al., "Clean Soldering with No Residue Flux", Proceedings of the 7th International Microelectronics Conference, Jun. 3-5, 1992, pp. 187-193.
N. Bandyopadhyay et al., "Development of Fluxless Soldering Process for Surface Mount Technology", Soldering and Surface Mount Technology, No. 4, Feb. 1990, pp. 23-26.

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