Clamping device for plate-shaped semiconductor components

Details Clamping device for plate-shaped semiconductor components Clamping device for plate-shaped semiconductor components

1983-04-11

1987-01-20

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 803, 165185, 174 16HS, 357 79, 357 81, 361386, H05K 720

Patent

active

046384049

ABSTRACT:
A device which clamps a plurality of plate-shaped semiconductor components to a heat sink provided with a recess having a plurality of walls formed by respective inner faces of the heat sink comprises a pressure element disposed in the recess. Lateral surfaces of the pressure element are oriented parallel to the wall of the recess and the semiconductor components are sandwiched between the lateral surfaces of the pressure element and the recess walls. A clamping element engages the end faces of the pressure element. Upon the compressing of the pressure element by the clamping element, the lateral surfaces of the pressure element are forced laterally outwardly and perpendicularly to the recess walls, whereby the semiconductor components are pressed against the walls of the recess. The pressure element advantageously consists of elastically compressible material or may be composed of two wedges which can be moved relative to each other.

REFERENCES:
patent: 3315136 (1967-04-01), Lob
patent: 3366171 (1968-01-01), Scharli
patent: 3735206 (1973-05-01), Pesek
patent: 4459639 (1984-06-01), Heil et al.
patent: 4521829 (1985-06-01), Wessely

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