Process for repairing data transmission lines of imagers

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

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216 21, 216 23, 216 65, 257 59, 349139, 438 4, 438707, H01L 2100, B44C 122

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active

059769785

ABSTRACT:
A method of repairing severed or damaged data transmission lines of an imager provides a shunt path around the electrical defect in the data transmission line by means of a diode common transmission line. The repair shunt includes a first scan line segment, a common electrode segment, and a second scan line segment, which segments are fused together and to the data line having the electrical defect to bypass the electrical defect. The respective conductive lines are fused together with spot welds formed with the application of a laser. A repaired imager has a data line having an open circuit defect, with respective first and second portions of said data line being coupled to a repair shunt comprising an associated pixel scan line segment and a common electrode segment. In one embodiment of the present invention, a plurality of spot welds are provided in the imager array, each in its unwelded state but capable of being welded by the application of heat.

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