Process for the formation of a silicon-containing semiconductor

Fishing – trapping – and vermin destroying

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437 4, 437108, 437109, 437225, 437228, 437234, 148DIG122, 427 541, 427331, 427337, H01L 2100, H01L 2102, H01L 21223, H01L 21383

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049277863

ABSTRACT:
Disclosed herein is a process for forming a silicon-containing semiconductor thin film, said process comprising the steps of causing a film-forming raw material gas containing silicon atoms as the conventional atoms in the molecule to be adsorbed in liquid form on the cooled substrate surface and subsequently causing the liquefied film-forming raw material gas to react with chemically active hydrogen atoms, thereby solidifying the silicon-containing material and forming a thin film on the substrate surface.
The process of the present invention provides good step coverage and smoothens the substrate surface. It also makes it possible to increase the degree of integration of memory devices, photosensitive devices, image inputting devices, imaging devices, etc. Moreover, it makes it possible to realize the three-dimensional integrated circuits.

REFERENCES:
patent: 4058418 (1977-11-01), Lindmayer
patent: 4119744 (1978-10-01), Brissot et al.
patent: 4141764 (1979-02-01), Authier et al.
patent: 4159354 (1979-06-01), Milnes et al.
patent: 4676868 (1987-06-01), Riley et al.

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