Reactive ion etching appartus

Details Reactive ion etching appartus Reactive ion etching appartus

1988-10-18

1990-05-22

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156643, 118 501, 118719, 118730, 118733, H01L 2102

Patent

active

049274848

ABSTRACT:
A reactive ion etching apparatus includes first and second reactive chambers in a single buffer room. First and second stages are placed in front of corresponding reactive chambers. The centers of the reactive chambers and stages form a square. A first transfer arm transfers a wafer between the first reactive chamber and the first stage, a second transfer arm transfers the wafer among the first and second reactive chambers and the first and second stages, and a third transfer arm transfers the wafer between the second reactive chamber and the second stage. The second transfer arm is pivotably mounted at the center of the square and may turn a full 360.degree..

REFERENCES:
patent: 4563240 (1986-01-01), Shibata et al.
patent: 4687542 (1987-08-01), Davis et al.
patent: 4693777 (1987-09-01), Hazano et al.
Hitachi's piece-by-piece treating type dry-etching apparatus "Model 206A type" advertisement.

Affiliated with

Also associated with

Rating

Reactive ion etching appartus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reactive ion etching appartus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reactive ion etching appartus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2132457