Method for making a flush surface laminate for a multilayer circ

Details Method for making a flush surface laminate for a multilayer circ Method for making a flush surface laminate for a multilayer circ

1988-04-15

1990-05-22

Lesmes, George F.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156228, 156289, 1563069, 1563077, 156330, B32B 3126, B32B 3100, C09J 510

Patent

active

049274775

ABSTRACT:
A method for making flush circuit laminates for use in constructing a multilayer circuit board is disclosed. The method comprises laminating together a dielectric sheet(s) of material, such as glass cloth impregnated with epoxy resin, placed between predrilled or pre-punched sheets of a conductive material, such as copper, to form the desired flush circuit laminate, such as a flush surface power core, which, in turn, may be used with other laminates to construct the desired multilayer circuit board. This method allows thinner laminates to be made with acceptable dimensional tolerances which provides improved impedance characteristics compared to laminates made using conventional processes. Thus, the method provide a method of making a more compact, higher speed multilayer circuit board without sacrificing circuit density on the circuit board. If desired, the method may be carried out using all dry processes.

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patent: 4496793 (1985-01-01), Hanson
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"High Conductivity Ground Planes for Epoxy Boards"; IBM Bulletin; Johnson; Jul. 1978; pp. 558-559.
IBM Technical Disclosure Bulletin, vol. 10, No. 4, pp. 359-360, Sep. 1967, Peter et al, "Multilayer Circuit Fabrication".
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Johnson, High Conductivity Ground Planes for Epoxy Board, Jul. 1978, pp. 558-559.

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