Insulating adhesive for multilayer printed circuit board

Details Insulating adhesive for multilayer printed circuit board Insulating adhesive for multilayer printed circuit board

1996-10-10

1999-11-02

Dawson, Robert

Stock material or miscellaneous articles

Composite

Of epoxy ether

428901, 525524, 525930, B32B 1508

Patent

active

059766999

ABSTRACT:
An insulating adhesive for a multilayer printed circuit board, which is to be laminated to an internal layer circuit board coated with an undercoating agent comprising an epoxy resin and a curing agent therefor, and which comprises as essential components:

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Japan Abstract, JP7202418, vol. 95, No. 11, Aug. 4, 1995.

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