Transfer molding machine for encapsulation of semiconductor devi

Details Transfer molding machine for encapsulation of semiconductor devi Transfer molding machine for encapsulation of semiconductor devi

1995-02-21

1997-05-06

Mackey, James P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

100258A, 100295, 26427217, 425121, 425190, 425406, 425593, B29C 4514

Patent

active

056268866

ABSTRACT:
A transfer molding machine for encapsulation of semiconductor devices with a resin comprises a clamping mechanism with an electrically actuated toggle mechanism, a pair of upper and lower sections of a transfer mold, and at least one compensation unit including upper and lower plates and a plurality of elastic members held between said upper and lower plates. The compensation unit is arranged either between the upper stationary platen and the upper mold section or between the moving platen and the lower mold section to compensate the dimensional errors in the mold sections and clamping mechanism.

REFERENCES:
patent: 4044984 (1977-08-01), Shimizu et al.
patent: 4753160 (1988-06-01), Baird et al.
patent: 5059105 (1991-10-01), Baird
patent: 5059379 (1991-10-01), Tsutsumi et al.
patent: 5118271 (1992-06-01), Baird et al.
patent: 5259752 (1993-11-01), Scolamiero et al.
patent: 5344296 (1994-09-01), Laninga
patent: 5405255 (1995-04-01), Neu
patent: 5409362 (1995-04-01), Neu
English Abstract of Japanese Utility Model No. JP-P-3-6410, and copy of Japanese Utility Model, Feb., 1991.
English Abstract of Japanese Patent No. JP-B-61-3648, and copy of Japanese Patent, Feb., 1986.

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