Patterned conducting polymer surfaces and process for preparing

Details Patterned conducting polymer surfaces and process for preparing Patterned conducting polymer surfaces and process for preparing

1997-05-12

1999-11-02

Dixon, Merrick

Adhesive bonding and miscellaneous chemical manufacture

Methods

Making electrical conductors of indefinite length

156 53, 156 56, 427108, 427261, 427302, 427181, 430311, 430325, 430296, 205125, 205159, 252 81, 252422, 252518, H01B 702

Patent

active

059762845

ABSTRACT:
Patterned conducting polymer surfaces exhibiting excellent properties may be prepared by:

REFERENCES:
patent: 4699804 (1987-10-01), Miyata et al.
patent: 4710401 (1987-12-01), Warren, Jr.
patent: 4898766 (1990-02-01), Tamamura et al.
patent: 4945257 (1990-07-01), Marrocco, III
patent: 4946903 (1990-08-01), Gardella, Jr. et al.
patent: 5147968 (1992-09-01), Epstein et al.
patent: 5219490 (1993-06-01), Basu et al.
patent: 5219492 (1993-06-01), Osterholm et al.
patent: 5232631 (1993-08-01), Cao et al.
patent: 5252695 (1993-10-01), Niciri et al.
patent: 5266309 (1993-11-01), Gardella, Jr. et al.
patent: 5293261 (1994-03-01), Shashidhar et al.
patent: 5342737 (1994-08-01), Georger, Jr. et al.
patent: 5391463 (1995-02-01), Ligler et al.
patent: 5422194 (1995-06-01), Satoh et al.
patent: 5447824 (1995-09-01), Mutsaers et al.
patent: 5545308 (1996-08-01), Murphy et al.
patent: 5561030 (1996-10-01), Holdcroft et al.
patent: 5578351 (1996-11-01), Shashidhar et al.
patent: 5696207 (1997-12-01), Vargo et al.
patent: 5828432 (1998-10-01), Shashidhar et al.
R. V. Gregory et al, Synthetic Metals, vol. 28, pp. C-823-C835 (1989).
C. B. Gorman et al, Chemistry of Materials, vol. 7, pp. 526-529 (1995).
M. Hikita et al, Japan Journal of Applied Physics, vol. 24, pp. L79-L81 (5).
M. Okana et al, Journal of the Electrochemical Society, vol. 134, pp. 837-841 (1987).
M. C. Dos Santos et al, Phys. Rev. Lett., vol. 62, pp. 2499-2502 (1989).
M. C. Dos Santos, Synth. Metals, vol. 29, pp. E321-E327 (1989).
J. H. Cheung et al, Thin Solid Films, vol. 244, pp. 985-988 (1994).
G. B. Street et al, Molecular Crystals and Liquid Crystals, vol. 83, pp. 253-264 (1982).
J. Lei et al, Synthetic Metals, vol. 48, pp. 301-312 (1992).
C. Kakouris et al, Synthetic Metals, vol. 48, pp. 65-77 (1992).
P. A. Christensen et al, Electrochimica Acta, vol. 36, pp. 1263-1286 (1991).
J. M. Calvert, in Polymers for Microelectronics, Resists and Dielectrics, L.F. Thompson et al, Eds. ACS Symposium Series, No. 537, ACS Press, Washington DC, pp. 210-219, 1994.
L. S. van Dyke et al, Synthetic Metals, vol. 52, pp. 299-304 (1992).
R. Baumann et al, Synthetic Metals, vol. 54, pp. 243-249 (1993).
K. G. Neoh et al, Synthetic Metals, vol. 73, pp. 209-215 (1995).
M. F. Combarel et al, C. R. Acad. Sci. Ser. C., vol. 262, pp. 459-462 (1966).
M. Doriomedoff et al, J. Chim. Phys. (Paris), vol. 68, pp. 1055-1069 (1971).
T. Ito et al, J. Polym. Sci. Chem. Ed., vol. 12, pp. 11-20 (1974).
H. Shirakawa et al, J.C.S. Chem. Commun., pp. 578-579 (1977).
C. K. Chiang et al, Phys. Rev. Lett., vol. 39, pp. 1098-1101 (1977).
P. J. Nigrey et al, J.C.S. Chem. Commun., pp. 594-595 (1979).
A. G. MacDiarmid et al, Synth. Metals, vol. 1, pp. 101-118 (1980).
D. M. Ivory et al, J. Chem. Phys., vol. 71, pp. 1506-1507 (1979).
A. F. Diaz et al, J.C.S. Chem. Commun., pp. 635-636 (1979).
K. K. Kanazawa et al, J.C.S. Chem. Commun., pp. 854-855 (1979).
K. F. Schoch et al, Synthetic Metals, vol. 72, pp. 13-23 (1995).
E. M. Genies et al, Synth. Metals, vol. 36, pp. 139-177 (1990).
H. W. Gibson et al, J. Am. Chem. Soc., vol. 105, pp. 4417-4431 (1983).

Affiliated with

Also associated with

Rating

Patterned conducting polymer surfaces and process for preparing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Patterned conducting polymer surfaces and process for preparing , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Patterned conducting polymer surfaces and process for preparing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2129747